Tipaza University Announces Doctoral Scholarship Program with Turkish University
Tipaza University has announced a scholarship opportunity for doctoral students in collaboration with Eskisehir Technical University in Turkey, under the ERASMUS+ program. This initiative aims to provide international opportunities for students to enhance their academic and research experience, facilitating scientific exchange between universities.
Scholarship Details and Academic Mobility Program
The scholarship enables students to study at Eskisehir Technical University in Turkey. Two doctoral students from Tipaza University will be selected: one from the Department of Biological Sciences and the other from Environmental Engineering or Chemical Engineering. The program offers students the chance to experience diverse academic and research environments and participate in joint scientific projects within the ERASMUS+ network.
Application Requirements and Selection Process
The program has set specific eligibility criteria. An internal committee will review and rank applications based on the ERASMUS+ point system. Criteria include the student’s academic average (50%) and English language proficiency (50%). A minimum English level of B1 is required, and the student’s grade must be at least 60 out of 100. Additional points are awarded to students with disabilities (10 points), while points are deducted for previous ERASMUS participation (10 points).
In case of a tie in points, students will be ranked by academic average. If the averages are also equal, preference will be given to the younger student.
Application Deadline and Registration Procedures
The deadline for scholarship applications is December 28, 2025. All eligible students are encouraged to apply promptly to benefit from this valuable international academic opportunity.
Enhancing Academic Expertise
This scholarship provides doctoral students with a unique scientific experience outside their home university environment, fostering growth and development in their respective fields.
